The new HOTFLOW series from ERSA once again raises the bar when it comes to the reflow process. The design of the new ovens focused on optimising heat transfer and reducing maintenance time while increasing machine uptime and productivity.
The ERSA HOTFLOW 4 series ovens come in any configuration to suit your process. From the 4/8 with 8 heating zones to the 4/26 with its 26 heating zones. All HOTFLOW models share the same features:
The popular ERSA HOTFLOW 3 series ovens are of course still available. The 3/14 and 3/20 ovens are the proven workhorses of the reflow family and there are utilised in many 24/7 operations. Features include:
The ERSA HOTFLOW 3/14e and 3/20e ovens are energy efficient ovens with excellent thermal performance and optimised for the Pb-free process. They are economically priced and give maximum value for return on investment. Features include:
The New X-Reflow306 LF-AC is a bench top, convection batch oven which is also nitrogen ready. It is designed for Lead Free soldering. It has high performance, low cost, is well thought out and is designed for prototyping, laboratory testing, heat-resistance testing and low volume production. The X-Reflow306 LF-AC is the only oven on the market which meets the new test procedures for PCB laminate manufacture. The oven can simulate 6 or 8 (changeable) reflow cycles with accelerated cooling between cycles to room temperature with minimum operator intervention.
Some key features of the X-Reflow306 LF-AC are: